Special Talk

Dr. Greet Storms, ASML, The Netherlands

Short Biography
- SVP Head of Product Management EXE since April 1st 2023
- Product Management in EXE (started April 2020)
- Head of Node Transition Projects and Application Engineering (Started September 2025)
- Various roles in business line Applications as Product Manager: YieldStar 350 introduction, Process Control SW products in Imaging and Overlay between 2010 and 2015
- Started at ASML in 2008 in Metrology & Application Development
- Imec – Lithography & Metrology engineering
- Engineering degree in Electronics from University of Leuven, Belgium
Paper Title
High NA EUV Capabilities for High Volume Manufacturing
Abstract
Extreme Ultraviolet (EUV) lithography remains pivotal in enabling cost-effective scaling for advanced semiconductor manufacturing. The transition from 0.33 NA to 0.55 NA offers key customer value drivers and substantial benefits for high-volume manufacturing (HVM), including reduced patterning cost of technology through single exposure per layer, minimized defect density, and relieving multi-patterning design constraints to boost device performance.

As the High NA EUV installed base is growing, R&D activities at multiple customer sites and in the imec-ASML High NA Lab are unlocking the imaging capabilities of the High NA platform. Proven performance of the EXE:5000 and EXE:5200B systems and ecosystem
developments continue to drive pitch shrink.

This presentation outlines the recent progress in platform capability and maturity, including
proof data for upcoming Logic and DRAM nodes, and the system availability status.
Furthermore, we will present the roadmap for next-generation High NA EUV systems,
supporting node requirements for the coming decade while improving patterning cost.