Symposium A

AI × High-NA EUV × Novel Materials × Sustainability

Symposium A: AI × High-NA EUV × Novel Materials × Sustainability Organizers Tetsuo Harada (Univ. of Hyogo), Kentaro Matsunaga (Kioxia), Keiichiro Hitomi (Hitachi), Makoto Sakakibara (Hitachi High-Tech), Kuen-Yu Tsai (Natl. Taiwan Univ.), Junichi Yanagisawa (Univ. of Shiga Pref.), Toru Fujimori (Hitachi High-Tech), Julius Santillan (AIST), Fumihiko Hirose (Yamagata Univ.) and Seiji Nagahara (ASML)
Prof. Takahiro Kozawa, The University of Osaka, Japan Paper Title Dissolution mechanism of resist films Short Biography Takahiro Kozawa is a professor of SANKEN, The University of Osaka. He earned his BS and MS degrees in nuclear engineering from the University of Tokyo, and Ph. D. degree in chemical engineering from Osaka University in 1990, 1992, and 2003, respectively. His work is mainly focused on beam-material interaction and beam-induced reactions in resist materials.
Dr. Arame Thiam, Tokyo Electron Europe, Belgium Paper Title Novel Patterning Technologies enabling High NA EUV Logic and DRAM features scaling Short Biography Dr Arame Thiam is Senior Process Engineer at Tokyo Electron Belgium. She supports High NA EUV lithography joint learning program with imec, focusing on patterning exploration for Logic advanced technology nodes. After starting her career in CEA-Leti Grenoble Patterning group working on e-beam lithography, she joined Imec in 2015. Her focus was lithography process development support of Imec Interconnects, Beyond CMOS, OIO and Quantum computing programs. She received her M.Sc. and PhD in Microelectronics and Nanotechnologies from the University of Lille 1 (France).
Prof. Tsumoru Shintake, Okinawa Institute of Science and Technology, Japan Paper Title Status of EUV Lithography R&D Short Biography Borne in 1955 in Miyazaki Graduate from Kyushu University, PhD in Engineering Worked at KEK Laboratory, followed by RIKEN, Stanford University and jointed to OIST Okinawa in 2011. I made the two-mirror EUV lithography idea in 2024 Received Semiconductor of the year in 2025.
Dr. Anuja De Silva, Lam Research, USA Paper Title Extending the Scaling Roadmap Through Dry Patterning Innovation Short Biography Dr. Anuja De Silva is a Technical Director at Lam Research, leading advanced patterning and dry resist technology development through strategic collaborations across the semiconductor ecosystem. Prior to Lam, she spent more than a decade at IBM Research developing EUV lithography materials and patterning technologies that helped advance next-generation semiconductor manufacturing. She holds a B.A. in Chemistry from Mount Holyoke College and a Ph.D. in Chemistry from Cornell University. Dr. De Silva serves as Co-Chair of the SPIE Advanced Lithography & Patterning Conference on Advances in Patterning Materials and Processes, is a member of the IRDS Patterning Committee, and an Associate Editor for JM3. She has authored more than 80 technical publications and holds over 70 U.S. patents.
Dr. Toshiaki Tanigaki, Hitachi, Ltd., Japan Paper Title Electromagnetic Field Observations for Novel Materials by Electron Holography Short Biography Toshiaki Tanigaki is a Principal Researcher at Hitachi, Ltd.’s Research and Development Group. He received his PhD from Ritsumeikan University in 2004 and was a visiting researcher at RIKEN under Dr. Akira Tonomura’s FIRST Program from 2010 to 2014. Joining Hitachi in 2014, he became a Project Leader in 2019. His research centers on advanced electron microscopy, including a 1.2 MV aberration-corrected holography electron microscope, for high-precision imaging of electromagnetic fields and their applications in physics, materials science, and industry. He received the Seto Award from the Japanese Society of Microscopy in 2023.
Dr. Luciana Meli, IBM Research, USA
Dr. Ivan Pollentier, imec, Belgium Paper Title The importance of the atmospheric environment in EUV post-exposure events for metal oxide resists : from stability to optimization Short Biography Ivan Pollentier joined imec in 1993 after receiving a PhD in Physics engineering at the University of Gent (Belgium), where he was involved in lithography engineering and development of i-line, DUV and 193nm processes towards imec’s device programs. Since 2007, he is involved in resist and process related fundamental research in the field of EUV lithography.
Prof. D. Howard Fairbrother, Johns Hopkins University, USA Paper Title Dry Processing and Development Strategies for Advanced Lithography and Patterning Short Biography Dr. D(avid) Howard Fairbrother is Professor of Chemistry at Johns Hopkins University, where his materials research focuses on surface chemistry, electron-surface interactions and more recently the development of dry processes for semiconductor technologies. He received his B.A. in Chemistry from the University of Oxford, England, and his Ph.D. in Chemistry from Northwestern University. He joined the Department of Chemistry at Johns Hopkins in 1997 following postdoctoral research at the University of California, Berkeley.
Dr. Cheng Wang, Lawrence Berkeley National Laboratory, USA Paper Title CD-RSoXS: Chemically Sensitive 3D Metrology for EUV Patterning and Next-Generation 3D Semiconductor Nodes Short Biography Dr. Cheng Wang is a Physicist Staff Scientist at the Advanced Light Source, Lawrence Berkeley National Laboratory. He received his Ph.D. in physics from North Carolina State University in 2008. After joining the ALS, he led the development of resonant soft X-ray scattering for soft materials and the construction of the world’s first dedicated RSoXS beamline, ALS Beamline 11.0.1.2. He is a leading expert in soft X-ray metrology, using advanced synchrotron techniques—including X-ray scattering, microscopy, and spectroscopy—to elucidate the morphology, chemistry, and interfacial structures of complex materials. Within CHiPPS EFRC, he serves as Thrust Lead for characterization and advanced metrology development, advancing multimodal and operando tools to connect materials chemistry, structure, processing, and function on lithographic materials.
Dr. Douglas J. Guerrero, Brewer Sci., USA Paper Title Diversification of patterning materials in the EUV era Short Biography Douglas Guerrero is a Brewer Science assignee to imec in Leuven, Belgium. He is responsible for Brewer Technology Strategy and Management reporting to the CTO office. He joined Brewer Science in 1995 and led the development and commercialization of several Anti-reflecting coating products. He holds a PhD in Organic Chemistry from the University of Oklahoma, completed Post-doctoral work at the University of Texas-Dallas in the field of conducting polymers and is a SPIE fellow.