MNC 2019, Oct. 28-31, 2019
32nd International Microprocesses and Nanotechnology Conference
International Conference Center Hiroshima, Hiroshima, Japan


Oct 20
Invited session withdrawn
Deji Akinwande, Univ. of Texas, USA


On site registration will be available at venue.

June 24, 2019     ↓   July 1, 2019

Sep. 8, 2019

Oct. 3, 2019

Oct. 21, 2019

Nov. 30, 2019

    MNC 2020 Nov. 9-12, 2020  Osaka, Japan

Sister Conference
  MNE2019Movie (79MB)
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About MNC 2019
Microprocesses and Nanotechnology play an important role of technical backbone for constructing the advanced information communications society with ubiquitous net works of the 21st century.
The MNC conference is now in its 32nd year and is intended to provide a forum for discussing lithography science and process technology using photon, electron, ion, other energetic particles and nanomaterials. This conference covers not only their applications to micro-and nano-structure fabrication and related physics and devices, but also their fusion applications with other fields like bio, medical information, and communication technology.

1.Lithography and Related Technologies and Metrology
 1-1: Photolithography and Patterning
 1-2: Electron and Ion Beam Technologies
 1-3: Resist and Directed Self-Assembly
 2-1: Nanocarbons
 2-2: Nanodevices
 2-3: Nanofabrication
 2-4: Inorganic Nanomaterials
 2-5: Organic Nanomaterials
 2-6: NanoTool
3: Nanoimprint, Hybrid-NIL, Biomimetics, and Functional Surfaces
4: BioMEMS, Lab on a Chip, and Nanobiotechnology
5: Microsystem Technology and MEMS

Symp. A: Nano-Materials, Processes, and Devices for Next-Generation Edge AI
Symp. B: Atomic Layer Processing (ALP) Symposium
Symp. C: 2D Materials
Symp. D: Innovative Technologies for Direct Observation of Cellular Vital Phenomena
9:50-10:50, October 29
Rahil Hasan
Micron Memory, Japan

Future Fab and the Skills of Tomorrow

0:50-11:30, October 29  
Shintaro Yamamichi
IBM Research, Japan

Computing Reimagined – AI/quantum/IoT

11:30-12:10, October 29
Sasikanth Manipatruni
Kepler Computing, USA
Building the Next Ubiquitous Computing Device with Room Temperature Quantum Materials

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