MNC 2019, Oct. 28-31, 2019
32nd International Microprocesses and Nanotechnology Conference
International Conference Center Hiroshima, Hiroshima, Japan

Symposium A: Nano-materials, processes, and devices for next-generation edge AI
Organized by Seiya Kasai (Hokkaido Univ., Japan) and Hirofumi Tanaka (Kyushu Inst. of Technol., Japan)

Symposium B: Atomic Layer Processing (ALP) Symposium
Organized by Jiyoung Kim (Univ. of Texas at Dallas, USA), Jin-Seong Park (Hanyang Univ., Korea) and Hiroshi Arimoto (AIST, Japan)

Symposium C:2D Materials
Organized by Daiyu Kondo (Fujitsu, Japan)

Symposium D: Innovative Technologies for Direct Observation of Cellular Vital Phenomena
Organized by Atsushi Miura (Hokkaido Univ., Japan) and Shinya Kumagai (Meijo Univ., Japan)

1. Lithography and Related Technologies and Metrology 
1-1: Photolithography and Patterning
This session focuses on EUV, Immersion, DUV and other advanced photolithography, Design and Litho Co-optimization including OPC, SMO, Mask related technology and Advanced patterning technology including multiple patterning and spacer process. The topics of Metrology and Process control are also discussed.
1-2: Electron and Ion Beam Technologies
This session focuses on Electron and ion beam technologies such as lithography, metrology, inspection and repair tools. Metorology such as SEM, TEM, He ion microscopes and other technologies related to charged particles are also welcome.
1-3: Resist and Directed Self-Assembly
DUV, immersion and EUV resists, resist related materials, resist processes/characterization (Resolution, CDU, LER, pattern collapse, resist stochastics effect, outgassing, etc.). Directed Self-Assembly (DSA) related materials (block co-polymers, polymer blend, neutralization layer, top coating, guide materials, etc.), DSA processes/characterization (integration flow, annealing, surface control, metrology, defectivity, area selective deposition, etc.). Resist and DSA material and process related basic understanding, theory, modeling and simulation.
2-1 Nanocarbons 
Nanocabons, such as nanotube, fullerene, graphene, 2D materials, and nanomaterials containing graphite and diamond, and their related science and technologies including growth, fabrications, nanoelectronics, nanophotonics, nanomechanics, devices and integration.
2-2: Nanodevices
Nanodevices utilizing nanostructures. The target is more Moore, more than Moore, and beyond CMOS: nanoscale transistors, memories, sensors, and new conceptual electrical/magnetic devices. Optical devices such as LEDs, lasers, and detectors promising for optical interconnection and other advanced applications are included. Energy harvesting devices, e.g., solar cells, thermoelectric elements, and piezoelectric elements, are also in our scope.
2-3: Nanofabrication
Fabrication technology of nanostructures and characterizations of their detailed structure as well as electronic and/or photonic properties. Fabrication technologies such as scanning probe techniques,wet-chemical processes, self-organizing techniques, etc. Etching, deposition, and related subsurface processing using photon, electron- and ion-beams, plasma, and thermal energy. Physics and chemistry in nanofabrication processes and their modelings. Emerging technologies are also welcome.
2-4: Inorganic Nanomaterials
Theory, properties, characterization and application of nanomaterials such as semiconductor materials, ionic-conductor materials, functional oxides, quantum dots, nano-particles, nanowires, and nanosheets. Materials prepared by atomic layer control, self-organized or bottom-up approach and the interface/surface of these materials are also included.
2-5: Organic Nanomaterials
This session focuses on theory, preparative methods, characterization, properties, and application of organic nanomaterials including single molecules, molecular thin films, nanotubes, nanowires, and organic nanocrystals. The use of organic molecules in electronic, optical, thermoelectric or magnetic devices is also in our scope.
2-6: NanoTool
Novel observation, fabrication, repair and measurement methods based on techniques, such as scanning probe microscopy (SPM), optical microscopy, laser, scanning/transmission electron microscopy (SEM/TEM) and focused ion beam (FIB). Nanotool devices such as sensors based on nano- and microelectromechanical device and optical device, material characterization devices and bio tools for cell manipulation and measurement
3: Nanoimprint, Hybrid-NIL, Biomimetics, and Functional Surfaces
This session focuses nanoimprint/ nanoimprint-related fabrication technology, biomimetics, and functional surfaces. Process, machines, materials, devices, surface design and related areas are included.
4: BioMEMS, Lab on a Chip, and Nanobiotechnolog
Micro/Nano Electromechanical Systems (M/NEMS) are now widely applied to Chemical, Biochemical, Medical and Environmental fields, and a new research field called μ-TAS or Lab-on-a-Chip is expanding. Fusion of microelectronic devices with materials and methods in those fields is expected to open up new scientific and business areas. Papers are solicited in the following areas (but not limited): (1) MEMS/NEMS devices for Chemical, Biochemical, Medical and Environmental fields, (2) μ-TAS and Lab-on-a-chip, (3) Bio-chips for DNA, proteins and cells, (4) Fabrication technologies for (1), (2), (3).

5: Microsystem Technology and MEMS
Technologies for fabrication, design, and characterization of micro electromechanical systems (MEMS) which include micro sensors, microactuators, optical devices, RF devices, etc. Materials, integration and packaging techniques are also welcome.
Copyright(c) Since 2019, 32nd International Microprocesses and Nanotechnology Conference, All Rights Reserved.