Section – MNC 2022, Nov. 8-11, 2022

Section
1-1: Advanced Lithography and Patterning	This session focuses on EUV, Immersion, DUV and other advanced photolithography, design and litho co-optimization including OPC, SMO, mask related technology and Advanced patterning technology including multiple patterning and spacer process. The topics of metrology and process control are also discussed.
1-2: Electron and Ion Beam Technologies	This session focuses on electron and ion beam technologies such as lithography, metrology, inspection and repair tools. Metrology such as SEM, TEM, He ion microscopes and other technologies related to charged particles are also welcome.
1-3: Patterning Materials	Novel patterning materials, EUV, ArF (dry and immersion), DUV and UV resists, resist related materials, resist processes (both FEOL and BEOL)/characterization (Resolution, CDU, LER, pattern collapse, resist stochastics effect, outgassing, etc.). Directed Self-Assembly (DSA) related materials (block co-polymers, polymer blend, neutralization layer, top coating, guide materials, etc.), DSA processes/characterization (integration flow, annealing, surface control, metrology, defectivity, area selective deposition, etc.). Patterning materials related basic understanding, theory, modeling and simulation.
2-1 Nanocarbon & 2D Materials	Nanocabons, such as nanotube, fullerene, graphene, 2D materials, and nanomaterials containing graphite and diamond, and their related science and technologies including growth, fabrications, nanoelectronics, nanophotonics, nanomechanics, devices and integration.
2-2: Nanodevices	Nanodevices utilizing nanostructures. The target is more Moore, more than Moore, and beyond CMOS: nanoscale transistors, memories, sensors, and new conceptual electrical/magnetic devices. Optical devices such as LEDs, lasers, and detectors promising for optical interconnection and other advanced applications are included. Energy harvesting devices, e.g., solar cells, thermoelectric elements, and piezoelectric elements, are also in our scope.
2-3: Nanofabrication	Fabrication technology of nanostructures and characterizations of their detailed structure as well as electronic and/or photonic properties. Fabrication technologies such as scanning probe techniques,wet-chemical processes, self-organizing techniques, etc. Etching, deposition, and related subsurface processing using photon, electron- and ion-beams, plasma, and thermal energy.　Physics and chemistry in nanofabrication processes and their modelings. Emerging technologies are also welcome.
2-4: Inorganic Nanomaterials	Theory, properties, characterization and application of nanomaterials such as semiconductor materials, ionic-conductor materials, functional oxides, quantum dots, nano-particles, nanowires, and nanosheets. Materials prepared by atomic layer control, self-organized or bottom-up approach and the interface/surface of these materials are also included.
2-5: Organic Nanomaterials	This session focuses on theory, preparative methods, characterization, properties, and application of organic nanomaterials including single molecules, molecular thin films, nanotubes, nanowires, and organic nanocrystals. The use of organic molecules in electronic, optical, thermoelectric or magnetic devices is also in our scope.
2-6: NanoTool	Novel observation, fabrication, repair and measurement methods based on techniques, such as scanning probe microscopy (SPM), optical microscopy, laser, scanning/transmission electron microscopy (SEM/TEM) and focused ion beam (FIB). Nanotool devices such as sensors based on nano- and microelectromechanical device and optical device, material characterization devices and bio tools for cell manipulation and measurement
3: Nanoimprint, Hybrid-NIL, Biomimetics, and Functional Surfaces	This session focuses nanoimprint/ nanoimprint-related fabrication technology, biomimetics, and functional surfaces. Process, machines, materials, devices, surface design and related areas are included.
4: BioMEMS, Lab on a Chip, and Nanobiotechnolog	Micro/Nano Electromechanical Systems (M/NEMS) are now widely applied to Chemical, Biochemical, Medical and Environmental fields, and a new research field called μ-TAS or Lab-on-a-Chip is expanding. Fusion of microelectronic devices with materials and methods in those fields is expected to open up new scientific and business areas. Papers are solicited in the following areas (but not limited): (1) MEMS/NEMS devices for Chemical, Biochemical, Medical and Environmental fields, (2) μ-TAS and Lab-on-a-chip, (3) Bio-chips for DNA, proteins and cells, (4) Fabrication technologies for (1), (2), (3).
5: Microsystem Technology and MEMS	Technologies for fabrication, design, and characterization of micro electromechanical systems (MEMS) which include micro sensors, microactuators, optical devices, RF devices, etc. Materials, integration and packaging techniques are also welcome.
6: Atomic Layer Processing (ALP)	Atomic layer deposition/etching (ALD/ALE), area selective deposition/etching(ASD/ASE), chemical vapor deposition(CVD) and related precursors, processes, equipments, and applications. Surface reactions, monitoring, and simulations are also included.