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MNC 2018, November 13-16, 2018
31st International Microprocesses and Nanotechnology Conference
Sapporo Park Hotel, Sapporo, Japan |
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| Symposium A: Nano-Metrology for Exploring the Limit |
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Symposium B: Recent Progress of Atomic Layer Processing (ALP) Technology
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| Symposium C: Thermal and electronic properties of nanoscale interfaces
(Tentative Title) |
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| Symposium D: BioMEMS, Lab on a Chip, and Nanobiotechnology (Tentative Title) |
| 1. Lithography and Related Technologies and Metrology |
| 1-1: Photolithography and Patterning |
This session focuses on EUV, Immersion, DUV and other advanced photolithography,
Design and Litho Co-optimization including OPC, SMO, Mask related technology
and Advanced patterning technology including multiple patterning and spacer
process. The topics of Metrology and Process control are also discussed.
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| 1-2: Electron and Ion Beam Technologies |
This session focuses on Electron and ion beam technologies such as lithography,
metrology, inspection and repair tools. Metorology such as SEM, TEM, He
ion microscopes and other technologies related to charged particles are
also welcome.
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| 1-3: Resist and Directed Self-Assembly |
| DUV, immersion and EUV resists, resist related materials, resist processes/characterization
(Resolution, CDU, LER, pattern collapse, outgassing, etc.). Directed Self-Assembly
(DSA) related materials (block co-polymers, polymer blend, neutralization
layer, top coating, guide materials, etc.), DSA processes/characterization
(integration flow, annealing, surface control, metrology, defectivity,
area selective deposition, etc.). Resist and DSA material and process related
basic understanding, theory, modeling and simulation. |
| 2:Nanotechnology |
| 2-1 Nanocarbons |
Nanocabons, such as carbon nanotube, fullerene, graphene containing layered
materials, and nanomaterials containing graphite and diamond, and their
related technologies including growth, fabrications, nanoelectronics, nanophotonics, nanomechanics,
devices and integration.
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| 2-2: Nanodevices |
Nanodevices utilizing nanostructures. The target is more Moore, more than
Moore, and beyond CMOS: nanoscale transistors, memories, sensors, and new
conceptual electrical/magnetic devices. Optical devices such as LEDs, lasers,
and detectors promising for optical interconnection and other advanced
applications are included. Energy harvesting devices, e.g., solar cells,
thermoelectric elements, and piezoelectric elements, are also in our scope.
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| 2-3: Nanofabrication |
Fabrication technology of nanostructures and characterizations of their detailed structure as well as electronic and/or photonic properties. Fabrication technologies such as scanning probe techniques,wet-chemical processes, self-organizing techniques, etc. Etching, deposition, and related subsurface processing using photon, electron- and ion-beams, plasma, and thermal energy. Physics and chemistry in nanofabrication processes and their modelings. Emerging technologies are also welcome.
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| 2-4: Inorganic Nanomaterials |
Theory, properties, characterization and application of nanomaterials such
as semiconductor materials, ionic-conductor materials, functional oxides,
layered structure, quantum dots, nano-particles, nanowires and thin films.
Materials prepared by atomic layer control, self-organized or bottom-up
approach and the interface/surface of these materials are also included.
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| 2-5: Organic Nanomaterials |
This session focuses on theory, preparative methods, characterization,
properties, and application of organic nanomaterials including single molecules,
molecular thin films, nanotubes, nanowires, and organic nanocrystals. The
use of organic molecules in electronic, optical, thermoelectric or magnetic
devices is also in our scope.
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| 2-6: NanoTool |
Novel observation, fabrication, repair and measurement methods based on techniques, such as scanning probe microscopy (SPM), optical microscopy, laser, scanning/transmission electron microscopy (SEM/TEM) and focused ion beam (FIB). Nanotool devices such as sensors based on nano- and microelectromechanical device and optical device, material characterization devices and bio tools for cell manipulation and measurement
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| 3: Nanoimprint, Hybrid-NIL, Biomimetics, and Functional Surfaces |
This session focuses nanoimprint/ nanoimprint-related fabrication technology,
biomimetics, and functional surfaces. Process, machines, materials, devices,
surface design and related areas are included.
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| 4: BioMEMS, Lab on a Chip, and Nanobiotechnolog |
Micro/Nano Electromechanical Systems (M/NEMS) are now widely applied to Chemical, Biochemical, Medical and Environmental fields, and a new research field called μ-TAS or Lab-on-a-Chip is expanding. Fusion of microelectronic devices with materials and methods in those fields is expected to open up new scientific and business areas. Papers are solicited in the following areas (but not limited): (1) MEMS/NEMS devices for Chemical, Biochemical, Medical and Environmental fields, (2) μ-TAS and Lab-on-a-chip, (3) Bio-chips for DNA, proteins and cells, (4) Fabrication technologies for (1), (2), (3).
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| 5: Microsystem Technology and MEMS |
Technologies for fabrication, design, and characterization of micro electromechanical systems (MEMS) which include micro sensors, microactuators, optical devices, RF devices, etc. Materials, integration and packaging techniques are also welcome.
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