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MNC 2018, November 13-16, 2018
31st International Microprocesses and Nanotechnology Conference
Sapporo Park Hotel, Sapporo, Japan |
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Dr. Anthony Yen;
ASML, Vice President and Head of Technology Development Centers
EUV Lithography at Threshold of High-Volume Manufacturing and Beyond |
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EUV lithography will enter high-volume manufacturing in 2019 to provide
the necessary technology for continued scaling of integrated circuits.
ASML is developing EUV scanners with higher throughput and tighter overlay
specifications to further enhance productivity and capability. For integrated-circuit
manufacturing beyond the first generation EUV, several fundamental topics
are being investigated to enable single-patterning at lower k1 values.
One of them is the resolution and much-discussed stochastic behavior of
EUV photoresists; another one is the three-dimensional nature of the photomask;
and a third is the use of phase-inclusive source-mask optimization to maximize
the process latitude due to the mask-side non-telecentricity of the EUV
projection optics. Overcoming these limitations will allow EUV lithography
to extend into the next decade with minimal use of double patterning. Finally,
ASML and partner Zeiss are developing high-NA (0.55) EUV exposure systems,
already with customer orders, to maintain continued scaling in semiconductor
manufacturing well into the next decade. |
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Anthony Yen heads ASML’s Technology Development Centers worldwide. Prior to the current position, he was with TSMC (2006 – 2017) where he led the development of EUV lithography for high-volume manufacturing of integrated circuits. From 1991 to 1997, he was a researcher with Texas Instruments where he worked on various techniques to enhance the practical resolution of microlithography. From 1997 to 2003, he was with TSMC where he first led the development of lithography processes for TSMC's 0.25, 0.18, 0.15, and 0.13 micron generations of logic integrated circuits and then co-led infrastructure development for next-generation lithography technologies at SEMATECH. From 2003 to 2006 he was with Cymer where he headed its marketing organization. Tony obtained his BS degree in electrical engineering from Purdue University and his SM, EE, PhD , and MBA degrees from MIT. He has over 100 US patents and 90 publications. He is a fellow of SPIE and IEEE. |
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