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MNC
2010, 23rd International
Microprocesses and Nanotechnology Conference
November 9-12, 2010, Rihga Royal Hotel Kokura, Fukuoka, Japan
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1-1:DUV, EUV Lithography and Metrology
This session focuses on DUV, EUV, Immersion Lithography, and Computational
Lithography including OPC, SMO, DFM. In addition, Metrology such as SEM
and Scatterometry, and Mask related topics are included.
1-2:Electron- and Ion-Beam Lithography
Electron and ion beam technologies such as lithography, metrology, inspection
and repair tools. Other related technologies using charged particle beams
are also welcome.
1-3:Resist Materials and Processing
Resist materials(EUV, immersion, double patterning, DUV, EB, X-ray, multilayer,
inorganic, molecular glass etc.), antireflective coatings, polyimide, adhesive,
and other materials related to lithography. resist processes(PEB，development,
rinse，resist removal, etching etc.), characterization, line edge roughness,
trade-off problem, outgassing, modeling and simulation of resist process
(exposure, acid diffusion, development etc.). materials and processes for
the production of flat-panel display, photonics devices, and electronics
packaging.
2-0 Nanocarbons
Nanocabons, such as carbon nanotube, fullerene, graphene and nanomaterials
containing graphite and diamond, and their related technologies including
growth, fabrications, nanoelectronics, nanophotonics, nanomechanics, devices and
integration.
2-1:Nanodevices
Nanodevices and related technologies targeting more Moore, more than Moore
and beyond CMOS; next-generation Si and compound semiconductor-based FETs,
graphene FETs, 1D FETs such as nanowire FETs and carbon nanotube FETs,
quantum dot devices, and all other nanodevices utilizing nanostructures
and nanomaterials such as inorganics, organics, and molecules. Light emitting
diodes, lasers, and detectors promising for optical interconnection and
other advanced applications are included. Solar cells, thermoelectric elements,
piezoelectric elements, and all other energy conversion devices utilizing
nanostructures and nanomaterials are also welcome.
2-2:Nanofabrication
Fabrication of nanostructures. Fabrication techniques such as scanning
probe techniques, self-organizing techniques, etc. Physics and chemistry
in nanofabrication processes. Etching, deposition, and related subsurface
processing using photon, electron- and ion-beams, plasma, and thermal energy.
Emerging technologies are also welcome.
2-3:Nanomaterials
Theory, properties, characterization and application of nanomaterials such
as semiconductor materials, functional oxides, layered structure, quantum
dots, nano-particles, nanowires, and organic, molecules. Materials prepared
by self-organized or bottom-up approach are also included.
2-4:Nano-Tool
Nano-electromechanical system (NEMS), Nano-mechanics, Nanometrology, Metrology
and repair for nanosystem, Novel observation and fabrication methods based
on microscopic techniques, such as scanning probe microscopy (SPM), scanning
electron microscopy (SEM) and focused ion beam (FIB).
3:Nanoimprint, Nanoprint and Rising Lithography
This session focuses nanoimprint system, process, material, applications and related inspection and metrology. Other novel nano-patterning technologies are also included.
4:Bio MEMS, Lab on a Chip
Micro/Nano Electromechanical Systems (M/NEMS) are now widely applied to
Chemical, Biochemical, Medical and Environmental fields, and a new research
field called μ-TAS or Lab-on-a-Chip is expanding. Fusion of microelectronic
devices with materials and methods in those fields is expected to open
up new scientific and business areas. Papers are solicited in the following
areas (but not limited): (1) MEMS/NEMS devices for Chemical, Biochemical,
Medical and Environmental fields, (2) μ-TAS and Lab-on-a-chip, (3) Bio-chips
for DNA, proteins and cells, (4) Fabrication technologies for (1), (2),
(3).
5:Microsystem Technology and MEMS
Technologies for fabrication, design, and characterization of micro electromechanical
systems (MEMS) which include sensors, microactuators, optical devices,
RF devices, etc. Integration and packaging techniques are also welcome.
SPECIAL SYMPOSIUM
Symposium A: Symposium A
Cost-Effective Efficient Litho Technologies
- Holding the Keys
to "Green Lithography"
Organizers: T. Sato (Toshiba) and S. Nagahara (Renesas Electronics).
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