Chairperson:
Vice-Chairpersons:
|
T. Meguro (Tokyo Univ. of Sci.)
S. Akita (Osaka Pref. Univ.)
T. Kozawa (Osaka Univ.)
|
1-1:DUV, EUV Lithography and Metrology |
Section Head:
Sub Head:
Members: |
T. Sato
(Toshiba)
S. Nagahara (Renesas Electronics)
J. Ahn (Hanyang Univ.)
H. Futatsuya (Fujitsu Microelectronics)
M. Shibuya (Tokyo Polytechnic Univ.)
J. Kitano (Tokyo Electron) )
J. Miyazaki (ASML)
H. Mohri (DNP)
T. Yahiro (Nikon)
A. Yamaguchi (Hitachi)
|
1-2:Electron- and Ion-Beam Lithography |
Section Head:
Sub Head:
Members: |
Y.
Miyamoto (Tokyo Inst. of Technol.)
J. Yanagisawa (Univ. of Shiga Pref.)
K.-Y. Tsai (National Taiwan Univ.)
S. Babin (aBeam Technology)
M. Kotera (Osaka Inst. of Technol.)
H. Nozue (Nuflare)
K. Ogino (Fujitsu)
A. Yamada (Advantest) J. Yamamoto (Hitachi)
Y. Yamamoto (SII Nanotechnology)
H. Yamashita (HOYA)
|
1-3:Resist Materials and Processing |
Section Head:
Sub Head:
Members: |
T.
Kozawa (Osaka Univ.)
H.
Oizumi (Selete)
T. Azuma (Toshiba)
K. Maruyama (JSR)
T. Hirayama (Tokyo Ohka)
H. Kudo (Kanagawa Univ.)
S. Masuda (Fuji Film)
K. Nakano (NEC) K. Nozaki (Fujitsu)
K. Okamoto (Hokkaido Univ.)
I. Takemoto (Sumitomo Chemical)
T. Yamaguchi (NTT)
|
2-0:Nanocarbon |
Section
Head:
Sub Head:
Members: |
M. Nagase (Tokushima Univ.)
K. Maehashi (Osaka Univ.)
J. Fujita (Univ. of Tsukuba)
H. Fukidome (Tohoku Univ.)
K. Hirahara (Osaka Univ.)
T. Kaneko (Tohoku Univ.)
M. Nagashio (Univ. of Tokyo)
M. Ohfuti (Fujitsu)
T. Takenobu (Waseda Univ.)
M. Tanemura (Nagoya Inst. of Technol.) |
2-1:Nanodevices |
Section Head:
Sub
Head:
Members: |
Y. Ohno (Nagoya
Univ.)
K. Nishiguchi
(NTT) T.-S. Chao(National Chiao Tung Univ.)
S. W. Hwang (Korea Univ.)
J.-T. Sheu (National Chiao Tung Univ.)
N. Banno (NEC)
H. Ikeda (Shizuoka Univ.) S. Kasai (Hokkaido Univ.)
T. Maemoto (Osaka Inst. of Technol.)
|
2-2:Nanofabrication |
Section Head:
Sub Head:
Members: |
M.
Masahara (AIST)
T. Hasegawa (NIMS)
T. Asahi (Ehime Univ.)
Y. Ishikawa (Univ. of Tokyo)
A. Kohno (Fukuoka Univ.)
T. Kobayashi (Riken)
T. Komeda (Tohoku Univ.)
S. Shingubara (Kansai Univ.)
K. Takase (Nihon Univ.)
T. Hasunuma (Tsukuba Univ.) |
2-3:Nanomaterials |
Section Head:
Sub Head:
Members:
|
T.
Chikyo (NIMS)
Y. Matsumoto (Tokyo Inst. of Technol.)
E.-K. Kim (Hanyang Univ.)
T. Ishida (AIST)
M. Lippmaa (Univ. of Tokyo) T. Mano (NIMS)
T. Miyazawa (Univ. of Tokyo) K. Tanii (Waseda Univ.)
X.W. Zhao (Tokyo Univ. of Sci)
|
2-4:Nano-Tool |
Section Head:
Sub Head:
Members: |
S.
Akita (Osaka Pref. Univ.)
S.Takahashi (Univ. of Tokyo)
H. Ina (Canon)
M. Kitazawa (Olympus)
D.-W. LeeiChonnam National Univ.)
G. Dai (Physikalisch-Technische) Y. Mitsui (Hitachi Hightechnologies)
M. Miyoshi (Univ. of Tokyo)
T. Ono (Tohoku Univ.)
M. Yasutake (SII Nano technol.j
|
3:Nanoimprint, Nanoprint and Rising Lithography |
Section Head:
Sub Head:
Members: |
H.
Hiroshima (AIST)
A. Yokoo (NTT) F.-B. Hsiao (National Cheng Kung Univ.)
H. Lee (Korea Univ.)
F.-Y. Chang (National Taiwan Univ.)
Y. Hirai (Osaka Pref. Univ.)
A. Miyauchi (Hitachi)
M. Okinaka (Canon)
N. Sakai (Samsung Yokohama Res. Inst.)
J. Taniguchi (Tokyo Univ. of Sci.)
|
4:Bio MEMS, Lab on a Chip |
Section Head:
Sub Head:
Members: |
Y.
Takamura (JAIST) Y. Murakami (Hiroshima Univ.)
G.-B. Lee (Natioal Cheng Kung Univ.)
F.-G. Tseng (National Tsing Hua Univ.)
T. Horiuchi (NTT)
T. Ichiki (Univ. of Tokyo)
H. Takei (Toyo Univ.)
Y. Miyahara (Tokyo Medical and Dental Univ.)
|
5:Microsystem Technology and MEMS |
Section Head:
Sub Head:
Members: |
T.
Ikehara (AIST) H. Takao (Kagawa Univ.)
J. Hsieh (Asia Pacific Microsystems)
W. Fang (National Tsing Hua Univ.)
J.-K. Shin (Kyungpook Univ.)
Y. Kanamori (Tohoku Univ.)
N. Miki (Keio Univ.)
T. Namazu (Univ. of Hyogo)
M. Sohgawa (Osaka Univ.)
D. Takamuro (Mitsubishi Electric)
|