MNC 2013
26th International Microprocesses and Nanotechnology Conference
Nov. 5-8, 2013
, Royton Sapporo, Hokkaido, Japan





1-1: Advanced Photolithography
This session focuses on DUV, EUV, Immersion Lithography, Computational Lithography including OPC, SMO, DFM, Mask related and other advanced photolithography. The topics of Metrology and Process control are also discussed.


1-2: Electron and Ion Beam Technologies
This session focuses Electron and ion beam technologies such as lithography, metrology, inspection and repair tools. Metorology such as SEM, TEM, He ion microscopes and other technologies related to charged particles are also welcome.


1-3: Resist and Directed Self-Assembly
DUV, immersion and EUV resists, resist related materials, resist processes/characterization (Resolution, CDU, LER, pattern collapse, outgassing, etc.). Directed Self-Assembly (DSA) related materials (block co-polymers, polymer blend, neutralization layer, top coating, guide materials, etc.), DSA processes/characterization (integration flow, annealing, surface control, metrology, defectivity etc.). Resist and DSA material and process related basic understanding, theory, modeling and simulation.


2-1 Nanocarbons
Nanocabons, such as carbon nanotube, fullerene, graphene containing layered materials, and nanomaterials containing graphite and diamond, and their related technologies including growth, fabrications, nanoelectronics, nanophotonics, nanomechanics, devices and integration.

2-2: Nanodevices
Nanodevices utilizing nanostructures and nanomaterials. The target is more Moore, more than Moore, and beyond CMOS: nanoscale transistors, memories, sensors, and new conceptual electrical/magnetic devices. Optical devices such as LEDs, lasers, and detectors promising for optical interconnection and other advanced applications are included. Energy harvesting devices, e.g., solar cells, thermoelectric elements, and piezoelectric elements, are also in our scope.


2-3: Nanofabrication
Fabrication technology of nanostructures and characterizations of their detailed structure as well as electronic and/or photonic properties. Fabrication technologies such as scanning probe techniques,wet-chemical processes, self-organizing techniques, etc. Etching, deposition, and related subsurface processing using photon, electron- and ion-beams, plasma, and thermal energy. Physics and chemistry in nanofabrication processes and their modelings. Emerging technologies are also welcome.


2-4: Inorganic Nanomaterials
Theory, properties, characterization and application of nanomaterials such as semiconductor materials, ionic-conductor materials, functional oxides, layered structure, quantum dots, nano-particles, nanowires and thin films. Materials prepared by atomic layer control, self-organized or bottom-up approach and the interface/surface of these materials are also included.

2-5: Organic Nanomaterials
This session focuses on theory, preparative methods, characterization, properties, and application of organic nanomaterials including molecular thin films, nanotubes, nanowires, and organic nano crystals. The use of organic molecules in electronic, optical, or magnetic devices is also in our scope.

2-6: NanoTool
Novel observation, fabrication and measurement methods based on techniques, such as scanning probe microscopy (SPM), optical microscopy, scanning electron microscopy (SEM) and focused ion beam (FIB). Nano-electromechanical system (NEMS), Nano-mechanics, Nanometrology, Metrology, and repair for nanosystem.


3: Nanoimprint, Nanoprint and Rising Lithography
This session focuses nanoimprint system, process, material, applications and related inspection and metrology. Other novel nano-patterning technologies are also included.


4: BioMEMS, Lab on a Chip
Micro/Nano Electromechanical Systems (M/NEMS) are now widely applied to Chemical, Biochemical, Medical and Environmental fields, and a new research field called μ-TAS or Lab-on-a-Chip is expanding. Fusion of microelectronic devices with materials and methods in those fields is expected to open up new scientific and business areas. Papers are solicited in the following areas (but not limited): (1) MEMS/NEMS devices for Chemical, Biochemical, Medical and Environmental fields, (2) μ-TAS and Lab-on-a-chip, (3) Bio-chips for DNA, proteins and cells, (4) Fabrication technologies for (1), (2), (3).


5: Microsystem Technology and MEMS
Technologies for fabrication, design, and characterization of micro electromechanical systems (MEMS) which include micro sensors, microactuators, optical devices, RF devices, etc. Integration and packaging techniques are also welcome.


SYMPOSIUM
Directed Self-Assembly
 Organizer: S. Nagahara (Tokyo Electron)

Directed Nanostructure Science
 Organizer: S. Matsui (Univ. of Hyogo)



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