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SCOPE
1-1: Lithography and Metrology
This session focuses on DUV, EUV, Immersion Lithography, and Computational Lithography including OPC, SMO, DFM. In addition, Metrology such as SEM and Scatterometry, and Mask related topics are included.
Electron- and Ion-Beam Lithography Electron and ion beam technologies such as lithography, metrology, inspection and repair tools. Other related technologies using charged particle beams are also welcome.
1-2: Resist Materials and Processing
Resist materials(EUV, immersion, double patterning, DUV, EB, X-ray, multilayer,
inorganic, molecular glass, directed self-assembly etc.), antireflective
coatings, polyimide, adhesive, and other materials related to lithography.
resist processes(PEB，development, rinse，resist removal, etching etc.),
characterization, line edge roughness, trade-off problem, outgassing, modeling
and simulation of resist process (exposure, acid diffusion, development
etc.). materials and processes for the production of flat-panel display,
photonics devices, and electronics packaging.
2-0 Nanocarbons
Nanocabons, such as carbon nanotube, fullerene, graphene and nanomaterials
containing graphite and diamond, and their related technologies including
growth, fabrications, nanoelectronics, nanophotonics, nanomechanics, devices
and integration.
2-1: Nanodevices
Nanodevices utilizing nanostructures and nanomaterials. The target is more Moore, more than Moore, and beyond CMOS: nanoscale transistors, memories, sensors, and new conceptual electrical/magnetic devices. Optical devices such as LEDs, lasers, and detectors promising for optical interconnection and other advanced applications are included. Energy harvesting devices, e.g., solar cells, thermoelectric elements, and piezoelectric elements, are also in our scope.
2-2: Nanofabrication
Fabrication technology of nanostructures and characterizations of their
detailed structure as well as electronic and/or photonic properties. Fabrication
technologies such as scanning probe techniques,wet-chemical processes,
self-organizing techniques, etc. Etching, deposition, and related subsurface
processing using photon, electron- and ion-beams, plasma, and thermal energy. Physics
and chemistry in nanofabrication processes and their modelings. Emerging
technologies are also welcome.
2-3: Nanomaterials
Theory, properties, characterization and application of nanomaterials such as semiconductor materials, functional oxides,spintronics materials, layered structure, quantum dots, nano-particles, nanowires, and organic, molecules.
Materials prepared by atomic layer control, self-organized or bottom-up approach is also included.
2-4: Nano Tool
Nano-electromechanical system (NEMS), Nano-mechanics, Nanometrology, Metrology and repair for nanosystem, Novel observation and fabrication methods based on microscopic techniques, such as scanning probe microscopy (SPM), scanning electron microscopy (SEM) and focused ion beam (FIB).
3: Nanoimprint, Nanoprint and Rising Lithography
This session focuses nanoimprint system, process, material, applications
and related inspection and metrology. Other novel nano-patterning technologies
are also included.
4: BioMEMS, Lab on a Chip
Micro/Nano Electromechanical Systems (M/NEMS) are now widely applied to
Chemical, Biochemical, Medical and Environmental fields, and a new research
field called μ-TAS or Lab-on-a-Chip is expanding. Fusion of microelectronic
devices with materials and methods in those fields is expected to open
up new scientific and business areas. Papers are solicited in the following
areas (but not limited): (1) MEMS/NEMS devices for Chemical, Biochemical,
Medical and Environmental fields, (2) μ-TAS and Lab-on-a-chip, (3) Bio-chips
for DNA, proteins and cells, (4) Fabrication technologies for (1), (2),
(3).
5: Microsystem Technology and MEMS
Technologies for fabrication, design, and characterization of micro electromechanical systems (MEMS) which include micro sensors, microactuators, optical devices, RF devices, etc. Integration and packaging techniques are also welcome.
SYMPOSIUM
Symposium on Patterning
Innovation for Sub-20 nm Devices
Symp. A: Extreme Ultraviolet Lithography and Lithography Extensions
T. Sato (Toshiba) and S. Nagahara (Tokyo Electron)
Symp. B: Nanoimprint
S. Matsui (Univ. of Hyogo) and A. Yokoo (NTT)
Symp. C: Directed Self Assembly
T. Yamaguchi (NTT)
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