MNC 2009, November 16-19, 2009
22nd International Microprocesses and Nanotechnology Conference
Conference Site: Sheraton Sapporo Hotel, Sapporo, Japan

Sheraton Sapporo, Sapporo, Japan




Organizing Committee Members
Chair 
Vice Chair

Members
S. Shoji (Waseda Univ.)
T. Asano (Kyushu Univ.)
T. Fukui (Hokkaido Univ.)
H. Arimoto (Fujitsu)
R. Ebinuma (Canon)
K. Fujii (NEC Electronics)
N. Fukushima (Toshiba)
K. Hane (Tohoku Univ.)
N. Hayashi (Dai Nippon Printing)
Y. Horiike (NIMS)
T. Horiuchi (Tokyo Denki Univ.)
K. Ishibashi (Riken)
A. Ishihama (Sharp)
S. Ishihara (Univ. of Tokyo)
S. Kadomura (Sony)



M. Kameyama (Nikon)
M. Komuro (NEDO)
S. Matsui (Univ. of Hyogo)
I. Mori (Selete)
Y. Ochiai (Toyo Gosei)
S. Okazaki (EUVA)
S. Sato (Fujitsu Labs.)
S. Tagawa (Osaka Univ.)
Y. Todokoro (Nara Inst. Sci. & Technol.)
H. Yamaguchi (NTT)
N. Yoshioka (Renesas Technol.)
S. Zaima (Nagoya Univ.) 
Advisory Members
H. Ahmed  (Cambridge Univ.)
Y. Aoyagi (Ritsumeikan Univ.)
S. Brueck (Univ. of New Mexico)
C.Y. Chang (Natl. Nano Device Lab.)
S.Y. Chou (Princeton Univ.)
E. Dobisz (Hitachi San Jose Res.)
F. Fortagne (Leica Microsystem)
K. Gamo (Osaka Univ.)
S. De Gendt (IMEC)
E. Gogolides (IMEL, NCSR)
L.R. Harriott (Univ. of Virginia)
O. Joubert (CRS-LTM)
D. Kern (Univ. of Tubingen)
H.W.P. Koops (NaWoTec GmbH)
J. Melngailis (Univ. of Meryland)
S.-K. Min (Kyung Hee Univ.)
A.R. Neureuther (UC Berkeley)
R.F.W. Pease (Stanford Univ.)
I. Raptis (IMEL, NCSR)
K. Ronse (IMEC)
R. Shimizu (IIAS)
C. Shih (ERSO/ITRI)
H.I. Smith (MIT)
T. Sugano (Univ. of Tokyo)
M. Takai (Osaka Univ.)
S. Tedesco (Leti)
T. Tsurushima (Kyushu Univ.)
M. Wang (China Academic Sci.)
J. Wiesner (Nikon Precision)
N. Yokoyama (Fujitsu Labs.)
Steering Committee Members
Chair
Vice Chair
Program
Secretary
Tressure
Seminar
Public Information
Publicity
Technical Exhibition
Place
Overseas
 
T. Itani (Selete)
Y. Miyamoto (Tokyo Inst. of Technol.)
T. Meguro (Tokyo Univ. of Sci.)
K. Nakano (NEC)
Y. Ono (NTT)
S. Kasai (Hokkaido Univ.)
S. Akita (Osaka Pref. Univ.)
H. Yamashita (HOYA)
N. Sakai (Toyo Gosei)
S. Hara (Hokkaido Univ.) 

J.H. Ahn (Hanyang Univ.)
O.H. Kim (POSTEC)



Y. Ono (NTT)
S. Aoyama (Renesas)
F. Nihey (AIST)
K. Tohmezuka (Tokyo Electron)
T. Kozawa (Osaka Univ.)
N. Taneichi (Tokyo Ohka)
M. Takeyama (Kitami Inst. of Technol.)
A. Chen (ASML)
C.K. Sung (National Tsing Hua Univ.)
Program Committee Members
Chairperson:
Vice-Chairpersons:

T. Meguro (Tokyo Univ. of Sci.)
S. Akita (Osaka Pref. Univ.)
T. Kozawa (Osaka Univ.)
1-1:DUV, VUV, EUV Lithography and Metrology
Section Head:

Sub Head:

Members:
T. Sato (Toshiba)

S. Nagahara (NEC Electronics)
J.H. Ahn (Hanyang Univ.)

T. Chijimatsu (Fujitsu)
N. Hirayanagi (Nikon),
J. Kitano (Tokyo Electron),
Y. Morikawa (DNP)
M. Suzuki (Canon)
A. Yamaguchi (Hitachi)
1-2:Electron- and Ion-Beam Lithography
Section Head:

Sub Head:

Members:
Y. Miyamoto (Tokyo Inst. of Technol.)

J. Yanagisawa (Univ. of Shiga Pref.)

K.-Y. Tsai (National Taiwan Univ.)

S. Babin (aBeam Technology)
M. Kotera (Osaka Inst. of Technol.)
H. Nozue (NuFlare Tech.)
K. Ogino (Fujitsu)
A. Yamada (Advantest)
J. Yamamoto (Hitachi)
Y. Yamamoto (SII Nanotechnology)
H. Yamashita (HOYA)
 
1-3:Resist Materials and Processing
Section Head:

Sub Head:

Members:
T. Kozawa (Osaka Univ.)

H. Oizumi (Selete)

T. Azuma (Toshiba)
M. Endo (Osaka Univ.)
M. Goethals (IMEC)
H. Hada (Tokyo Ohka)
Y. Hirai (JSR)
H. Horibe (Kanazawa Inst. of Technol.)
H. Kudo (Kanagawa Univ.)
S. Masuda (Fuji Film)
K. Nakano (NEC)
K. Nozaki (Fujitsu)
I. Takemoto (Sumitomo Chemical)
2-1:Nanodevices
Section Head:

Sub Head:



Members:
Y. Ohno (Nagoya Univ.)

S. Kasai (Hokkaido Univ.)
T.-S. Chao(National Chiao Tung Univ.)
S.W. Hwang (Korea Univ.)
J.-T. Sheu (National Chiao Tung Univ.)


N. Banno (NEC)
N. Fukata (NIMS)
K. Maehashi (Osaka Univ.)
T. Maemoto (Osaka Inst. of Technol.)
K. Nagashio (Univ. of Tokyo)
K. Nishiguchi (NTT)
S. Shingubara (Kansai Univ.)
2-2:Nanofabrication
Section Head:

Sub Head:

Members:
M. Masahara (AIST)

T. Hasegawa (NIMS)

T. Asahi (Osaka Univ.)
T. Chikyo (NIMS)
Y. Ishikawa (Univ. of Tokyo)
T. Kobayashi (Riken)
A. Kohno (Fukuoka Univ.)
T. Komeda (Tohoku Univ.)
K. Takase (Nihon Univ.)
X.W. Zhao (Tokyo Univ. of Sci)
2-3:Nanomaterials
Section Head:

Sub Head:

Members:
T. Yoshinobu (Tohoku Univ.)

Y. Tajima (Riken)
E.K. Kim (Hanyang Univ.)

J. Fujita (Univ. of Tsukuba)
T. Ishida (AIST)
T. Miyazawa (Univ. of Tokyo)
T. Takenobu (Tohoku Univ.)
K. Tanii (Waseda Univ.)
2-4:Nano-Tool
Section Head:

Sub Head:

Members:
M. Nagase (NTT)

S. Akita (Osaka Pref. Univ.)

H. Ina (Canon)
M. Kitazawa (Olympus)
D.-W. Lee (Chonnam National Univ.)
Y. Mitsui (Hitachi Hightechnologies)
M. Miyoshi (Univ. of Tokyo)
T. Ono (Tohoku Univ.)
S. Takahashi (Univ. of Tokyo)
M. Yasutake (SII NanoTechnology)
3:Nanoimprint, Nanoprint and Rising Lithography
Section Head:

Sub Head:

Members:
H. Hiroshima (AIST)

A. Yokoo (NTT)
F.-B. Hsiao (National Cheng Kung Univ.)

Y. Hirai (Osaka Pref. Univ.)
H. Lee (Korea Univ.)
A. Miyauchi (Hitachi)
M. Okinaka (Canon)
N. Sakai (Toyo Gosei)
J. Taniguchi (Tokyo Univ. of Sci.)
 
4:Bio MEMS, Lab on a Chip
Section Head:

Sub Head:



Members:
T. Ichiki (Univ. of Tokyo)

Y. Takamura (JAIST)
G.-B. Lee (Natioal Cheng Kung Univ.)
F.-G. Tseng (National Tsing Hua Univ.)

T. Horiuchi (NTT)
W-T. Liu (National University of Singapore)
H. Takei (Toyo Univ.)
Y. Miyahara (NIMS)

Y. Murakami (Hiroshima Univ.)
5:Microsystem Technology and MEMS
Section Head:

Sub Head:




Members:
K. Suzuki (Ritsumeikan Univ.)

T. Ikehara (AIST)
W. Fang (National Tsing Hua Univ.)
J.-W. Hsieh (Asia Pacific Microsystems)
J. Shin (Kyungpook Univ.)

H. Kuwano (Tohoku Univ.)
Y. Suzuki (Nikon)
Z. Rymuza(Warsaw Univ. of Technol.)
H. Takao (Toyohashi Univ. of Technol.)
T. Tsuchiya (Kyoto Univ.)
D.F. Wang (Ibaraki Univ.)

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