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MNC 2016, November 8-11, 2016
29th International Microprocesses and Nanotechnology Conference
ANA Crowne Plaza Kyoto, Kyoto, Japan |
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| 1. Lithography and Related Technologies and Metrology |
| 1-1: Advanced Photolithography |
This session focuses on EUV, Immersion, DUV and other advanced photolithography,
Design and Litho Co-optimization including OPC, SMO, Mask related technology
and Advanced patterning technology including multiple patterning and spacer
process. The topics of Metrology and Process control are also discussed.
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| 1-2: Electron and Ion Beam Technologies |
This session focuses on Electron and ion beam technologies such as lithography, metrology, inspection and repair tools. Metorology such as SEM, TEM, He ion microscopes and other technologies related to charged particles are also welcome.
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| 1-3: Resist and Directed Self-Assembly |
DUV, immersion and EUV resists, resist related materials, resist processes/characterization (Resolution, CDU, LER, pattern collapse, outgassing, etc.). Directed Self-Assembly (DSA) related materials (block co-polymers, polymer blend, neutralization layer, top coating, guide materials, etc.), DSA processes/characterization (integration flow, annealing, surface control, metrology, defectivity etc.). Resist and DSA material and process related basic understanding, theory, modeling and simulation.
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| 2:Nanotechnology |
| 2-1 Nanocarbons |
Nanocabons, such as carbon nanotube, fullerene, graphene containing layered materials, and nanomaterials containing graphite and diamond, and their related technologies including growth, fabrications, nanoelectronics, nanophotonics, nanomechanics, devices and integration.
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| 2-2: Nanodevices |
Nanodevices utilizing nanostructures. The target is more Moore, more than Moore, and beyond CMOS: nanoscale transistors, memories, sensors, and new conceptual electrical/magnetic devices. Optical devices such as LEDs, lasers, and detectors promising for optical interconnection and other advanced applications are included. Energy harvesting devices, e.g., solar cells, thermoelectric elements, and piezoelectric elements, are also in our scope.
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| 2-3: Nanofabrication |
Fabrication technology of nanostructures and characterizations of their detailed structure as well as electronic and/or photonic properties. Fabrication technologies such as scanning probe techniques,wet-chemical processes, self-organizing techniques, etc. Etching, deposition, and related subsurface processing using photon, electron- and ion-beams, plasma, and thermal energy. Physics and chemistry in nanofabrication processes and their modelings. Emerging technologies are also welcome.
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| 2-4: Inorganic Nanomaterials |
Theory, properties, characterization and application of nanomaterials such as semiconductor materials, ionic-conductor materials, functional oxides, layered structure, quantum dots, nano-particles, nanowires and thin films. Materials prepared by atomic layer control, self-organized or bottom-up approach and the interface/surface of these materials are also included.
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| 2-5: Organic Nanomaterials |
This session focuses on theory, preparative methods, characterization, properties, and application of organic nanomaterials including molecular thin films, nanotubes, nanowires, and organic nanocrystals. The use of organic molecules in electronic, optical, or magnetic devices is also in our scope.
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| 2-6: NanoTool |
Novel observation, fabrication, repair and measurement methods based on techniques, such as scanning probe microscopy (SPM), optical microscopy, laser, scanning/transmission electron microscopy (SEM/TEM) and focused ion beam (FIB). Nanotool devices such as sensors based on nano- and microelectromechanical device and optical device, material characterization devices and bio tools for cell manipulation and measurement
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| 3: Nanoimprint, Nanoprint and Rising Lithography |
This session focuses nanoimprint system, process, material, applications and related inspection and metrology. Other novel nano-patterning technologies are also included.
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| 4: BioMEMS, Lab on a Chip |
Micro/Nano Electromechanical Systems (M/NEMS) are now widely applied to Chemical, Biochemical, Medical and Environmental fields, and a new research field called μ-TAS or Lab-on-a-Chip is expanding. Fusion of microelectronic devices with materials and methods in those fields is expected to open up new scientific and business areas. Papers are solicited in the following areas (but not limited): (1) MEMS/NEMS devices for Chemical, Biochemical, Medical and Environmental fields, (2) μ-TAS and Lab-on-a-chip, (3) Bio-chips for DNA, proteins and cells, (4) Fabrication technologies for (1), (2), (3).
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| 5: Microsystem Technology and MEMS |
Technologies for fabrication, design, and characterization of micro electromechanical systems (MEMS) which include micro sensors, microactuators, optical devices, RF devices, etc. Materials, integration and packaging techniques are also welcome.
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