{"id":654,"date":"2021-06-17T16:27:45","date_gmt":"2021-06-17T07:27:45","guid":{"rendered":"http:\/\/imnc.jp\/2021\/?page_id=654"},"modified":"2021-07-21T21:58:00","modified_gmt":"2021-07-21T12:58:00","slug":"symposium","status":"publish","type":"page","link":"http:\/\/imnc.jp\/2021\/symposium\/","title":{"rendered":"Symposium"},"content":{"rendered":"\n<table id=\"tablepress-15\" class=\"tablepress tablepress-id-15\">\n<thead>\n<tr class=\"row-1 odd\">\n\t<th class=\"column-1\">Symposium<\/th><th class=\"column-2\">Organizer<\/th><th class=\"column-3\">Symposium Title<\/th><th class=\"column-4\">Link<\/th>\n<\/tr>\n<\/thead>\n<tbody class=\"row-hover\">\n<tr class=\"row-2 even\">\n\t<td class=\"column-1\"><Strong>Symposium A<\/td><td class=\"column-2\">Organizers:<br \/>\nSeiji Nagahara (Tokyo Electron)<br \/>\nTomoki Nagai (JSR)<br \/>\nShinji Okazaki (ALITECS)<br \/>\nTakahiro Kozawa (Osaka Univ.)<\/td><td class=\"column-3\">EUVL Stochastics Symposium:  Overcoming the Challenge of <br \/>\nStochastics for High Resolution EUV Lithography<br \/>\n<br \/>\nFor the future EUV lithography for fine patterns including high <br \/>\nNA EUV lithography, EUV induced stochastics issues are still one <br \/>\nof the biggest concerns for reliable patterning for future <br \/>\nsemiconductor devices. This EUVL Stochastics Symposium will <br \/>\nhighlight the challenges and solutions for stochastics issues for <br \/>\nthe future EUV lithography. The symposium will deal with EUV <br \/>\nstochastics from a variety of aspects such as exposure tools, <br \/>\nresist materials, processes, masks, resist stochastics models and <br \/>\nsimulations. In addition to the invited talks, the symposium has <br \/>\nan panel discussion by leading experts in the field for further <br \/>\ndiscussion of the topics.<\/td><td class=\"column-4\"><a href=\"http:\/\/imnc.jp\/2021\/symposium-a\/\">Here<\/a><\/td>\n<\/tr>\n<tr class=\"row-3 odd\">\n\t<td class=\"column-1\"><Strong>Symposium B<a href=\"http:\/\/imnc.jp\/2021\/symposium-b\/\"><\/td><td class=\"column-2\">Organizers:<br \/>\nDaiyu Kondo (Fujitsu)<br \/>\nAtsushi Ando (AIST)<\/td><td class=\"column-3\">Forefront of low-dimensional nanomaterials<br \/>\nfor future applications<br \/>\n<br \/>\nLow dimensional nanomaterials including graphene, carbon nanotubes, fullerene, and TMDCs have attracted a great deal of public and academic attentions due to their own characteristic structures and\/or physical properties for last few decades. Here, we select the front of the research of these materials for \u00a0future applications as a focus area. In this symposium, the latest achievements on low dimensional materials will be\u00a0 introduced by five invited speakers.<br \/>\n <br \/>\n<\/td><td class=\"column-4\"><a href=\"http:\/\/imnc.jp\/2021\/symposium-b\/\">Here<\/a><\/td>\n<\/tr>\n<tr class=\"row-4 even\">\n\t<td class=\"column-1\"><Strong>Symposium C<a href=\"http:\/\/imnc.jp\/2021\/symposium-c\/\"><\/td><td class=\"column-2\">Organizer:<br \/>\nKazuaki Furukawa (Meisei Univ.)<\/td><td class=\"column-3\">Biological Phenomena and Functions within <br \/>\nMicro- and Nanospace<br \/>\n<br \/>\nThanks to the downsizing of medical devices, we have benefited<br \/>\nin our daily life: thinner needle reduces pain in injection, Lab on a <br \/>\nChip technology reduces an amount of sample for medical check. <br \/>\nIn this symposium, we focus on cutting-edge biological research <br \/>\nin combination with micro and nanostructures. Some new aspects <br \/>\nin biological phenomena within such small spaces will be introduced <br \/>\nby four invited speakers. They must be essential to further developments<br \/>\nin biological devices and applications. <\/td><td class=\"column-4\"><a href=\"http:\/\/imnc.jp\/2021\/symposium-c\/\">Here<\/a><\/td>\n<\/tr>\n<tr class=\"row-5 odd\">\n\t<td class=\"column-1\"><Strong>Symposium D<a href=\"http:\/\/imnc.jp\/2021\/symposium-d\/\"><\/td><td class=\"column-2\">Organizer:<br \/>\nKoji Asakawa (KIOXIA)<\/td><td class=\"column-3\">Enhancing technology for next generation <br \/>\nlithography<br \/>\n<br \/>\nThe performance of semiconductors has been boosted by on-going reduction of their fabrication sizes.\u00a0\u00a0 However, it is realized not only by reduction in lithographic resolution but also strongly by peripheral technologies such as multiple pattering, pattern transfer techniques and high etch durability materials.\u00a0 This symposium focuses on the emerging materials and technologies that empowers the conventional methods to be finer, harder, and more precise for device fabrication.<\/td><td class=\"column-4\"><a href=\"http:\/\/imnc.jp\/2021\/symposium-d\/\">Here<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<!-- #tablepress-15 from cache -->\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-noside.php","meta":[],"_links":{"self":[{"href":"http:\/\/imnc.jp\/2021\/wp-json\/wp\/v2\/pages\/654"}],"collection":[{"href":"http:\/\/imnc.jp\/2021\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"http:\/\/imnc.jp\/2021\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"http:\/\/imnc.jp\/2021\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/imnc.jp\/2021\/wp-json\/wp\/v2\/comments?post=654"}],"version-history":[{"count":2,"href":"http:\/\/imnc.jp\/2021\/wp-json\/wp\/v2\/pages\/654\/revisions"}],"predecessor-version":[{"id":661,"href":"http:\/\/imnc.jp\/2021\/wp-json\/wp\/v2\/pages\/654\/revisions\/661"}],"wp:attachment":[{"href":"http:\/\/imnc.jp\/2021\/wp-json\/wp\/v2\/media?parent=654"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}